Slot arrangement motherboard assembly

Details Slot arrangement motherboard assembly Slot arrangement motherboard assembly

2006-07-25

2006-07-25

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

07082039

ABSTRACT:
On a motherboard, a first slot for receiving a high-performance component that typically generates higher levels of heat and emissions is mounted next to a second slot for receiving a card that generates relatively lower levels of heat and emissions. The second slot is positioned between the first slot and the central processing unit (CPU) socket on the motherboard. Through this configuration, a CPU can be shielded from the heat and electromagnetic interference generated by with a high-performance component. The first slot can be positioned near the edge of the motherboard, further facilitating heat dissipation and access to the slot. In an embodiment, the first slot is an AGP slot and the second slot is a PCI slot.

REFERENCES:
patent: 6118670 (2000-09-01), Radford et al.
patent: 6324075 (2001-11-01), Unrein et al.

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