Miniature optical element for wireless bonding in an...

Details Miniature optical element for wireless bonding in an... Miniature optical element for wireless bonding in an...

2006-07-11

2006-07-11

Nguyen, Tua nH. (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S598000

Reexamination Certificate

active

07074632

ABSTRACT:
A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.

REFERENCES:
patent: 4348253 (1982-09-01), Subbarao et al.
patent: 4377316 (1983-03-01), Ecker et al.
patent: 4696885 (1987-09-01), Vijan
patent: 5108562 (1992-04-01), Duke et al.
patent: 5162258 (1992-11-01), Lemnios et al.
patent: 5438216 (1995-08-01), Juskey et al.
patent: 5786589 (1998-07-01), Segawa et al.
patent: 5808873 (1998-09-01), Celaya et al.
patent: 5841190 (1998-11-01), Noda et al.
patent: 5888884 (1999-03-01), Wojnarowski
patent: 6114768 (2000-09-01), Gaul et al.
patent: 6171883 (2001-01-01), Fan et al.
patent: 6175141 (2001-01-01), Hofbauer et al.
patent: 6225651 (2001-05-01), Billon
patent: 6251696 (2001-06-01), Ikeya et al.
patent: 6323546 (2001-11-01), Hsuan et al.
patent: 6383835 (2002-05-01), Hata et al.
patent: 6383837 (2002-05-01), Tsunashima
patent: 6392158 (2002-05-01), Caplet et al.
patent: 6404061 (2002-06-01), Hikita et al.
patent: 2002/0096760 (2002-07-01), Simelgor et al.
patent: 2003/0022475 (2003-01-01), Vieux-Rochaz et al.
patent: 1244949 (2000-02-01), None
patent: 2000-196014 (2000-07-01), None

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