Structure for interconnecting conductors and connecting method

Details Structure for interconnecting conductors and connecting method Structure for interconnecting conductors and connecting method

2006-03-28

2006-03-28

Lavilla, Michael E. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S671000, C428S674000, C428S336000, C428S213000, C428S658000, C228S193000, C228S262610

Reexamination Certificate

active

07018721

ABSTRACT:
A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a,11b,11c) constituting a part of a wiring pattern on a circuit board (1), and the second conductor is, for example, a terminal (20a,21a) or a terminal board (22) of an electronic component (20 21). The first conductor is connected with the second conductor through an Au—Zn alloy layer formed through diffusion of Zn from the solder containing Zn into the Au layer of the first conductor.

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