Method for fabricating a semiconductor component

Details Method for fabricating a semiconductor component Method for fabricating a semiconductor component

2006-03-07

2006-03-07

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S593000, C029S830000, C029S831000, C029S832000, C029S846000, C029S847000, C029S850000, C029S884000, C257S209000, C257SE23171, C361S778000, C438S128000, C438S131000, C438S132000

Reexamination Certificate

active

07007375

ABSTRACT:
A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the die, and terminal contacts on the substrate. The adjustment circuitry includes conductors and programmable links, such as fuses or anti-fuses, in electrical communication with the die and the terminal contacts. The adjustment circuit can also include capacitors and inductance conductors. The programmable links can be placed in a selected state (e.g., short or open) using a laser or programming signals. A method for fabricating the component includes the steps of forming the adjustment circuitry, and then placing the programmable links in the selected state to achieve the selected adjustment.

REFERENCES:
patent: 5132878 (1992-07-01), Carey
patent: 5200580 (1993-04-01), Sienski
patent: 5264729 (1993-11-01), Rostoker et al.
patent: 5301143 (1994-04-01), Ohri et al.
patent: 5544069 (1996-08-01), Mohsen
patent: 5691209 (1997-11-01), Liberkowski
patent: 5914524 (1999-06-01), Komenaka
patent: 5920110 (1999-07-01), Crafts et al.
patent: 5950070 (1999-09-01), Razon et al.
patent: 5973340 (1999-10-01), Mohsen
patent: 5982185 (1999-11-01), Farnworth
patent: 6008533 (1999-12-01), Bruce et al.
patent: 6157584 (2000-12-01), Holst
patent: 6222212 (2001-04-01), Lee et al.
patent: 6229227 (2001-05-01), Muthukumaraswamy et al.
patent: 6249014 (2001-06-01), Bailey
patent: 6277674 (2001-08-01), Wang et al.
patent: 6323534 (2001-11-01), Marr et al.
patent: 6333887 (2001-12-01), Vo
patent: 6348400 (2002-02-01), Schoenfeld
patent: 6351040 (2002-02-01), Schoenfeld
patent: 6391681 (2002-05-01), Corisis
patent: 6392291 (2002-05-01), Corisis
patent: 6425766 (2002-07-01), Panella
patent: 6449170 (2002-09-01), Nguyen et al.
patent: 6506981 (2003-01-01), Liberkowski
patent: 6528735 (2003-03-01), Bhatia et al.
patent: 6537850 (2003-03-01), Corisis
patent: 6649931 (2003-11-01), Honma et al.
patent: 6753482 (2004-06-01), Schoenfeld et al.
patent: 6914275 (2005-07-01), Schoenfeld et al.
patent: 2001/0031909 (2001-10-01), Faltys et al.
US 6,342,723, 01/2002, Wilford (withdrawn)

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