Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-04-11
2006-04-11
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S842000, C029S843000, C029S852000, C029S854000
Reexamination Certificate
active
07024763
ABSTRACT:
Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires to a first substrate, plating the wires with a non-etchable conductive material, encasing the plated wires with a dielectric material to form a second substrate, planing the second substrate to expose the etchable wire, and etching the wires to leave plated through holes. In a second method, wires coated with a first etchable layer are initially bonded to a substrate, a second non-etchable plating layer is then applied over the first layer, and the first layer is etched away leaving plated through holes with wires disposed inside. In a third embodiment, a layer of masking material is initially deposited on a substrate and etched to form holes which are filled with a sacrificial fill material, the masking material is then removed, the fill material plated, grinding is performed to remove some plating to expose the fill material, and the fill material is then etched away leaving plated attachment wells. Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires.
REFERENCES:
patent: 5476211 (1995-12-01), Khandros
patent: 5806181 (1998-09-01), Khandros
patent: 5974662 (1999-11-01), Eldridge
patent: 5994152 (1999-11-01), Khandros
patent: 6029344 (2000-02-01), Khandros et al.
patent: 6184053 (2001-02-01), Eldridge
patent: 6255126 (2001-07-01), Mathieu
patent: 6458696 (2002-10-01), Gross
patent: 6521842 (2003-02-01), Brinthaupt, III et al.
patent: 6538214 (2003-03-01), Khandros
patent: 6914468 (2005-07-01), Van Dijk et al.
patent: 2001/0044225 (2001-11-01), Eldridge et al.
Khandros Igor Y.
Mathieu Gaetan L.
Reynolds Carl
Arbes Carl J.
Fliesler & Meyer LLP
FormFactor Inc.
LandOfFree
Methods for making plated through holes usable as... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods for making plated through holes usable as..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for making plated through holes usable as... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3599892