Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2006-09-05
2006-09-05
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S433000, C257SE23031, C257SE31110
Reexamination Certificate
active
07102212
ABSTRACT:
In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.
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In the Matter of Certain Light-Emitting Diodes and Products Containing Same, Investigation No. 337-TA-512, “Notice of Commission Final Determination of No Violation of Section 337 as to One Patent and Determination to Remand the Investigation as Certain Other Patents,” Dated Aug. 10, 2005.
In the Matter of Certain Light-Emitting Diodes and Products Containing Same, Investigation No. 337-TA-512, “Initial Determination on Violation of Section 337 and Recommended Determination on Remedy and Bond,” (Public Version), Dated May 10, 2005.
In the Matter of Certain Light-Emitting Diodes and Products Containing Same, Investigation No. 337-TA-512, “Commission Opinion,” (Public Version), Dated Aug. 29, 2005.
Brunner Herbert
Schellhorn Franz
Waitl Guenther
Fish & Richardson P.C.
Osram GmbH
Zarneke David A.
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