Die attachment method using nonconductive adhesive for use in hi

Details Die attachment method using nonconductive adhesive for use in hi Die attachment method using nonconductive adhesive for use in hi

1989-03-28

1991-05-28

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437938, 437944, 357 80, H01L 2160, H01L 2314, H01L 23485

Patent

active

050195352

ABSTRACT:
A method for grounding or electrically biasing an integrated circuit chip without using a conductive die attach material comprises affixing the chips to a substrate using a thermoplastic polyimide adhesive. A metallization layer electrically connects the sides of the chips, which act as grounding surfaces, to a biased or grounded conductive layer on the substrate. The top surfaces of the integrated circuit chips which include the interconnection pads are protected against undesired metallization by a removable protective layer while the metallization layer is applied. Metal electroplated on the metallization layer serves the functions of a heat sink for the chip and a ground plane between chips.

REFERENCES:
patent: 4783695 (1988-11-01), Eichelberger et al.

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