Method of manufacturing piezoelectric wafers of saw...

Metal working – Piezoelectric device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S592100, C029S594000, C029S609100, C181S171000, C181S172000, C310S31300R, C310S31300R, C361S310000, C361S310000, C235S454000, C235S455000, C235S492000

Reexamination Certificate

active

07103948

ABSTRACT:
The invention provides a method of manufacturing piezoelectric wafers of surface acoustic wave (SAW) identification tags. In one embodiment, the method includes: (1) using a master reticle to form, on each of the piezoelectric wafers, wafer-independent patterns that encode digits of a first significance for SAW identification tags; and (2) using different ones of a library of coding reticles to form, on each of the piezoelectric wafers, wafer-dependent patterns that encode digits of a second significance for SAW identification tags.

REFERENCES:
patent: 4399441 (1983-08-01), Vaughan et al.
patent: 4625207 (1986-11-01), Skeie
patent: 5359250 (1994-10-01), Toda
patent: 6121892 (2000-09-01), Reindl et al.
patent: 6806808 (2004-10-01), Watters et al.
patent: 19622154 (1997-05-01), None
patent: 2 238 210 (1991-05-01), None
“Programmable reflectors for SAW-ID-tags”; Reindl, L.; Ruile, W.; Ultrasonics Synposium, 1993. Proceedings., IEEE 1993; Oct. 31-Nov. 3, 1993 pp.: 125-130 vol. 1.
“Design, Fabrication, and Application of GHz SAW Devices” by Ulrich Knauer, et al.; 1997 IEEE; pp. 1821-1030.
“Chipspurnasen fur Logistic” by E. Heinzelmann; Technische Rundschau, Online! No. 14; 1997; pp. 44-48.
“An Active Tagging System Using Circular Polarization Modulation” by Marcel Kossel, et al.; 1999 IEEE; pp. 1595-1598.
“A Global SAW ID Tag with Large Data Capacity” by Clinton S. Hartmann; 2002 IEEE Ultrasonics Symposium; pp. 65-69.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing piezoelectric wafers of saw... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing piezoelectric wafers of saw..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing piezoelectric wafers of saw... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3595579

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.