Pressure control system and polishing apparatus

Details Pressure control system and polishing apparatus Pressure control system and polishing apparatus

2006-05-23

2006-05-23

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S006000, C451S296000, C451S288000

Reexamination Certificate

active

07048609

ABSTRACT:
A pressure control system is used for eliminating individual differences of a plurality of pressure controllers used for controlling pressures of a plurality of pressure-controlled sections. The pressure control system includes a plurality of pressure controllers for supplying a pressurized fluid to a plurality of pressure-controlled sections, a master pressure controller for supplying a pressurized fluid having a reference pressure, a plurality of calibration chambers corresponding to the pressure controllers. The pressure control system further includes differential-pressure detecting devices provided in the calibration chambers to detect a differential pressure between the pressurized fluid supplied from the master pressure controller and the pressurized fluid supplied from the pressure controller, and an arithmetic device configured to receive a signal from the differential-pressure detecting device and adjust an output of the pressure controller so that the above differential pressure becomes zero or approximately zero.

REFERENCES:
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 6129613 (2000-10-01), Bothra
patent: 6241578 (2001-06-01), Togawa et al.
patent: 6275290 (2001-08-01), Cerni et al.
patent: 6594542 (2003-07-01), Williams
patent: 6857947 (2005-02-01), Wang et al.
patent: 2004/105112 (2004-12-01), None

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