Device for cooling hot spot in micro system

Details Device for cooling hot spot in micro system Device for cooling hot spot in micro system

2006-01-24

2006-01-24

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S715000, C257S784000, C438S122000, C361S689000, C361S699000

Reexamination Certificate

active

06989594

ABSTRACT:
A device and method for cooling a hot spot are provided. The cooling device for cooling a micro hot spot includes a first substrate, a first channel formed on the first substrate and having two narrowed ends, a second channel formed on the first substrate and connected to the first channel, a cooling fluid injected into the first channel and the second channel, a second substrate connected to the first substrate and having the micro hot spot disposed thereon, two of wires disposed at the narrowed ends of the first channel, and a power supply for providing a pulse current to the wires, thereby micro bubbles being produced around the wires.

REFERENCES:
patent: 2004/0104022 (2004-06-01), Kenny et al.
patent: 2005/0046017 (2005-03-01), Dangelo
patent: 2005/0139996 (2005-06-01), Myers et al.
patent: 469613 (2001-01-01), None

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