Group III nitride LED with silicon carbide substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide

Reexamination Certificate

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C257S084000, C257S094000, C257S103000, C372S044010

Reexamination Certificate

active

07071490

ABSTRACT:
The present invention is a semiconductor structure for light emitting devices that can emit in the red to ultraviolet portion of the electromagnetic spectrum. The semiconductor structure includes a Group III nitride active layer positioned between a first n-type Group III nitride cladding layer and a second n-type Group III nitride cladding layer, the respective bandgaps of the first and second n-type cladding layers being greater than the bandgap of the active layer. The semiconductor structure further includes a p-type Group III nitride layer, which is positioned in the semiconductor structure such that the second n-type cladding layer is between the p-type layer and the active layer. The semiconductor structure is built upon a silicon carbide substrate.

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“Export Report P-N Junction Location and Layer Conductivity in InGaN LED Chips Manufactured by _”.
“Export Report Title: Structure And Analysis Of InGaN LED Chips Manufactured By _”.

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