Method and structure for implementing column attach coupled...

Details Method and structure for implementing column attach coupled... Method and structure for implementing column attach coupled...

2006-05-02

2006-05-02

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S245000, C228S246000, C228S056300

Reexamination Certificate

active

07036709

ABSTRACT:
A method and structure are provided for implementing a column attach coupled noise suppressor for a solder column structure of the type used to join a substrate to a circuit card. The electrical noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at one end to either a substrate or a circuit card and are inserted through the elongated through openings of the electrical noise suppressor structure, spaced apart from the electrically conductive sidewalls. Then the solder columns are attached at the other end to the other one of the substrate or circuit card.

REFERENCES:
patent: 3744129 (1973-07-01), Dewey, Jr.
patent: 5678287 (1997-10-01), Smith et al.
patent: 6414248 (2002-07-01), Sundstrom
patent: 6458623 (2002-10-01), Goldmann et al.
patent: 2003/0189083 (2003-10-01), Olsen

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