Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2006-03-07
2006-03-07
Cuneo, Kamand (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S260000, C257S786000
Reexamination Certificate
active
07009115
ABSTRACT:
A method, system, and apparatus for optimizing routing layers and board space requirements for a ball grid array package is described. The ball grid array package includes a substrate material having a first side configured to receive a semiconductor chip and a second side having a plurality of conductive pads arranged in an array of rows and columns. The array of pads has at least one edge not fully populated with pads.
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Seaman Kevin L.
Wnek Vernon M.
Broadcom Corporation
Patel Ishwar (I. B).
Sterne Kessler Goldstein & Fox PLLC
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