Semiconductor laser

Details Semiconductor laser Semiconductor laser

2006-07-11

2006-07-11

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

C257S701000, C257S684000, C257S678000, C257S099000, C372S043010

Reexamination Certificate

active

07075178

ABSTRACT:
A die pad and a plurality of leads are integrally held by a resin portion made of mold resin, and a laser chip is mounted on the die pad through a sub-mount. The resin portion (2) has a base portion (21) that integrally holds the plurality of leads, and has a substantially round shape in an external shape thereof, and a die pad holding portion (22) that is continuously formed above the base portion, and holds the rear surface and the side portions of the die pad. The die pad holding portion has an external shape that is included inside a circle P having a diameter that is smaller than the outer diameter of the substantially round shape of the base portion.Consequently, it is possible to provide an optical-disk-use semiconductor laser, such as CD-use and DVD-use semiconductor laser, which has the same structure as the can-type structure and an inexpensive resin package.

REFERENCES:
patent: 10-209551 (1998-08-01), None
patent: 10209551 (1998-08-01), None
patent: 2000-266969 (2000-09-01), None
patent: 2000-357839 (2000-12-01), None
patent: 2001-111152 (2001-04-01), None
patent: 2001-111154 (2001-04-01), None

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