Back pressure control system for CMP and wafer polishing

Details Back pressure control system for CMP and wafer polishing Back pressure control system for CMP and wafer polishing

2006-03-07

2006-03-07

Rachuba, M. (Department: 3723)

Abrading

Machine

Rotary tool

C451S287000, C451S398000, C451S402000

Reexamination Certificate

active

07008309

ABSTRACT:
A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements are disposed between the wafer carrier pressure plate and a process wafer, and selectively distended to provide excess backpressure to select small areas of a wafer known to exhibit resistance to removal vis-á-vis the surrounding wafer surface. Distensible elements may be in the form of expandable pneumatic chambers or electro-mechanical elements such as solenoids, shape memory elements, electrostatic plates, etc.

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