Method and apparatus for monitoring parts in a material...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C700S096000, C700S115000, C705S028000

Reexamination Certificate

active

06985787

ABSTRACT:
The present invention presents an improved apparatus and method for monitoring parts in a material processing system, wherein the material processing system includes a processing tool, a number of RF-responsive part identifiers coupled to the processing tool to generate and transmit part ID data, and a sensor interface assembly (SIA) configured to receive the part ID data from the plurality of RF-responsive part identifiers.

REFERENCES:
patent: 5995046 (1999-11-01), Belcher et al.
patent: 6047579 (2000-04-01), Schmitz
patent: 6121926 (2000-09-01), Belcher et al.
patent: 6459726 (2002-10-01), Ovard et al.
patent: 6618640 (2003-09-01), Hittner et al.
patent: 6693432 (2004-02-01), Kraz
patent: 6898558 (2005-05-01), Klekotka
patent: 2002/0008621 (2002-01-01), Barritz et al.
patent: 2002/0014963 (2002-02-01), Trosper
patent: 2002/0080032 (2002-06-01), Smith et al.
patent: 2002/0087867 (2002-07-01), Oberle et al.
patent: 2003/0043027 (2003-03-01), Carson et al.
patent: 2003/0069648 (2003-04-01), Douglas et al.
patent: 2003/0130912 (2003-07-01), Davis et al.
patent: 2003/0233161 (2003-12-01), Cheng et al.
patent: 2004/0007326 (2004-01-01), Roche et al.
patent: 2004/0041714 (2004-03-01), Forster
patent: 2004/0126906 (2004-07-01), Klekotka
patent: 2004/0127030 (2004-07-01), Klekotka
patent: 2004/0127031 (2004-07-01), Klekotka
patent: 2004/0128021 (2004-07-01), Klekotka
patent: 2005/0067102 (2005-03-01), Baldwin et al.
patent: WO 01/82009 (2001-11-01), None
patent: WO 01/95242 (2001-12-01), None
patent: WO 02/17030 (2002-02-01), None
patent: WO 2004/059405 (2004-07-01), None
U.S. Appl. No. 60/378,384.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for monitoring parts in a material... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for monitoring parts in a material..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for monitoring parts in a material... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3574253

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.