Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate
2006-05-09
2006-05-09
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
C250S505100
Reexamination Certificate
active
07041512
ABSTRACT:
An electron beam exposure apparatus for exposing a wafer with an electron beam includes a section for generally controlling a wafer exposing system, a first buffer memory for temporarily storing exposure data, a second buffer memory for temporarily storing the exposure data, a first exposing section for irradiating the wafer with an electron beam based on exposure data output from the first buffer memory, and a first comparing section for comparing exposure data output from the first buffer memory with exposure data output from the second buffer memory and notifying the comparison results to the general control section. The exposure data stored in the first buffer memory and the exposure data stored in the second buffer memory are identical to one another when no error is involved. Further, an exposure apparatus and a pattern error detection method for accurately detecting an error of an exposure pattern formed to a wafer is disclosed.
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Fujiyoshi Kouji
Takigawa Masami
Advantest Corp.
Coleman W. David
Muramatsu & Associates
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