Method of recycling printed circuit board

Metal working – Method of mechanical manufacture – Scrap recovering or utilizing

Reexamination Certificate

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Details

C029S403300, C029S403100, C241S024130, C241S024180

Reexamination Certificate

active

07107661

ABSTRACT:
The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment4aand resin-metal separation equipment51are used in hot filtration process P400. The waste printed circuit board1is heated and force-filtered so that only the insulating material1apass through the filter. Then, the insulating material1aand the metallic material1bare separated and retrieved. It is preferred that the insulating body base23of the printed circuit board100as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. As a result, when the retrieved metallic material and the retrieved insulating material amount to necessities of recycling respectively, both the metallic material and the insulating material are possible for recycling.

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patent: A-2002-177922 (2002-06-01), None
patent: A-2002-233856 (2002-08-01), None
Notice of Preliminary Rejection dated Jan. 31, 2005 corresponding to Korean application.

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