Semiconductor package and method for manufacturing the same

Details Semiconductor package and method for manufacturing the same Semiconductor package and method for manufacturing the same

2006-05-16

2006-05-16

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257S780000, C257S773000, C257S786000, C257S692000

Reexamination Certificate

active

07045893

ABSTRACT:
A semiconductor package, and a method for fabricating the semiconductor package, includes a semiconductor die having a plurality of bond pads including a first bond pad positioned at a center of the bond pad and formed at a first surface of the semiconductor die and a second bond pad spaced from the first bond pad by a predetermined distance while surrounding the first bond pad. The semiconductor package includes first and second posts formed on the bond pads of the semiconductor die and a substrate formed with electrically conductive patterns corresponding to the bond pads of the semiconductor die and bonded to the post.

REFERENCES:
patent: 5347086 (1994-09-01), Potter et al.
patent: 5477086 (1995-12-01), Rostoker et al.
patent: 6184061 (2001-02-01), Wu et al.
patent: 6239385 (2001-05-01), Schwiebert et al.
patent: 6429046 (2002-08-01), Marlin

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