Coating processes – With post-treatment of coating or coating material – Heating or drying
Reexamination Certificate
2006-09-05
2006-09-05
Pezzuto, Helen L. (Department: 1713)
Coating processes
With post-treatment of coating or coating material
Heating or drying
C427S255140, C427S255180, C427S255600, C427S384000, C427S447000, C427S452000, C428S447000, C428S901000, C428S938000
Reexamination Certificate
active
07101591
ABSTRACT:
This invention provides a process for producing an organic polymer film whereby when using it as an interlayer insulating film in a semiconductor device, the film exhibits higher adhesiveness at its interfaces where other semiconductor materials are in contact with the lower and the upper surface of the film while an effective dielectric constant in the whole organic polymer film can be further reduced. Specifically, a plurality of organic monomers vaporized is sprayed onto a heated substrate surface via plasma generated in a reaction chamber to form a copolymer film comprising frame composed of a plurality of organic monomer units. During the process, relative ratio between the feeding rate of the organic monomer molecules is varied along the progress of the film growth to continuously grow an interlayer insulating film in which films having good mechanical strength and adhesiveness with rich content of siloxane-structure are set near the interfaces (91a,c, 92a,cor93a,c) and a film having a lower bulk density are arranged as an intermediate layer (91b, 92bor93b) sandwiched therebetween.
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T.M. Stokich, Jr., et al., “Real-Time FT-IR Studies of the Reaction Kinetics for the Polymerization of Divinyl Siloxane Bis-Benzocyclobutene Monomers”,Material Research Symposium Proceedings, vol. 227, 1991, pp. 103-114.
Hayashi Yoshihiro
Kawahara Jun
NEC Corporation
Pezzuto Helen L.
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