Interconnection for organic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Encapsulated

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S040000, C257S099000

Reexamination Certificate

active

07026660

ABSTRACT:
A device having bond pads within a bond pad region, the bond pads comprising a conductive material that is stable when exposed to atmospheric constituents. The bond pads can be formed from conductive oxide materials such as indium tin oxide. A contact layer is provided to enhance the conductivity between the bond pads and the active component of the device.

REFERENCES:
patent: 6210815 (2001-04-01), Ooishi
patent: 6307218 (2001-10-01), Steigerwald et al.
patent: 6548912 (2003-04-01), Graff et al.
patent: 6624572 (2003-09-01), Kim et al.
patent: 6656828 (2003-12-01), Maitani et al.
patent: 6661029 (2003-12-01), Duggal
patent: 2001/0017516 (2001-08-01), Gonther
patent: 2002/0074938 (2002-06-01), Gu
patent: 2003/0045016 (2003-03-01), Saito et al.
patent: 2003/0094591 (2003-05-01), Auch et al.
patent: 2003/0143423 (2003-07-01), McCormick et al.
patent: 2003/0209979 (2003-11-01), Guenther et al.
patent: 2003/0214232 (2003-11-01), Guenther et al.
patent: 02-135694 (1990-05-01), None
patent: 2001015268 (2001-01-01), None
patent: 2003017253 (2003-01-01), None
patent: WO 01/44865 (2001-06-01), None
patent: WO 01/45140 (2001-06-01), None
patent: WO 02/21883 (2002-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Interconnection for organic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnection for organic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnection for organic devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3567779

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.