Electronic part compression bonding apparatus and method

Electric heating – Heating devices – Combined with pressure application means

Reexamination Certificate

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Details

C228S102000, C219S085160

Reexamination Certificate

active

07075036

ABSTRACT:
An electronic part compression bonding apparatus includes a compression bonding unit which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit, a pressure control unit which controls pressure, a heating unit which heats the compression bonding unit, a temperature control unit, and a thermocompression bonding control unit which controls the pressure control unit and the heating unit based on thermocompression bonding condition data in which at least one of pressure and heating temperature is variably set during a process from start until completion of a thermocompression bonding operation of the electronic parts. In the thermocompression bonding condition data, the pressure is set to a first pressure in a first stage in a process of the thermocompression bonding operation and a second pressure, which is lower than the first pressure, in a second stage that follows the first stage.

REFERENCES:
patent: 5894982 (1999-04-01), Hasegawa et al.
patent: 5985064 (1999-11-01), Sato
patent: 6096575 (2000-08-01), Okada et al.
patent: 6494359 (2002-12-01), Hasegawa
patent: 2002/0109000 (2002-08-01), Rinne
patent: 5-144878 (1993-06-01), None
patent: 6-151524 (1994-05-01), None
patent: 7-130795 (1995-05-01), None
patent: 7-153795 (1995-06-01), None
patent: 8-213434 (1996-08-01), None
patent: 9-082764 (1997-03-01), None
patent: 9-153525 (1997-06-01), None
patent: 9-181131 (1997-07-01), None
patent: 9-186191 (1997-07-01), None
patent: 9-213740 (1997-08-01), None
patent: 10-4124 (1998-01-01), None
patent: 10-107404 (1998-04-01), None
patent: 10-175973 (1998-10-01), None
patent: 11-135564 (1999-05-01), None
patent: 11-186338 (1999-07-01), None
patent: 11-274701 (1999-10-01), None
patent: 2000-180883 (2000-06-01), None
patent: 2000-277893 (2000-10-01), None
patent: 2000-306927 (2000-11-01), None

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