Laminated ceramic electronic component and method of...

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S311000, C029S025420, C156S089120

Reexamination Certificate

active

07042706

ABSTRACT:
A multilayer ceramic electronic component includes a laminate having ceramic layers and internal electrodes stacked alternately one on another, and at least one kind of metal oxide between respective one of the ceramic layers and corresponding one of the internal electrodes. A method of manufacturing a multilayer ceramic electronic component includes a first step of stacking ceramic sheets and metal layers alternately one on another to fabricate a laminate and a second step of firing the laminate. Respective one of the metal layers has, on the surface of a sheet-like first metal, a second metal more susceptible to oxidation than the first metal. The second step is performed at an oxygen partial pressure at which the first metal is hardly oxidized and the second metal is oxidized.

REFERENCES:
patent: 3113253 (1963-12-01), Ishikawa et al.
patent: 5632833 (1997-05-01), Kurano et al.
patent: 5835339 (1998-11-01), Sakamoto et al.
patent: 5910881 (1999-06-01), Ueno
patent: 3-116810 (1991-05-01), None
patent: 7-37748 (1995-02-01), None
patent: 2000-340450 (2000-12-01), None
International Search Report for application No. PCT/JP02/10925 dated Jan. 21, 2003.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Laminated ceramic electronic component and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laminated ceramic electronic component and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laminated ceramic electronic component and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3566864

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.