Asymmetric band-gap engineered nonvolatile memory device

Static information storage and retrieval – Floating gate – Particular biasing

Reexamination Certificate

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C365S185290, C257S314000, C257S317000

Reexamination Certificate

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07072223

ABSTRACT:
Systems and methods are provided for nonvolatile memory devices that incorporate a band-gap engineered gate stack with asymmetric tunnel barriers. One embodiment of a memory device includes first and second source/drain regions separated by a channel region in a substrate, a control gate, and a gate stack between the control gate and the channel region. The gate stack includes a first insulator region in contact with the channel region, a floating charge-storage region in contact with the first insulator region, and a second insulator region in contact with the floating charge-storage region and the control gate. The gate stack includes selected material, in conjunction with control gate metallurgy, for providing desired asymmetric energy barriers that are adapted to primarily restrict carrier flow during programming to a selected carrier between the control gate and the floating charge-storage region, and to retain a programmed charge in the floating charge-storage region. Other aspects are provided herein.

REFERENCES:
patent: 3978577 (1976-09-01), Bhattacharyya et al.
patent: 4412902 (1983-11-01), Michikami et al.
patent: 4449205 (1984-05-01), Hoffman
patent: 4495219 (1985-01-01), Kato et al.
patent: 4717943 (1988-01-01), Wolf et al.
patent: 4780424 (1988-10-01), Holler et al.
patent: 4794565 (1988-12-01), Wu et al.
patent: 4870470 (1989-09-01), Bass, Jr. et al.
patent: 5043946 (1991-08-01), Yamauchi et al.
patent: 5332915 (1994-07-01), Shimoji et al.
patent: 5350738 (1994-09-01), Hase et al.
patent: 5445984 (1995-08-01), Hong et al.
patent: 5455792 (1995-10-01), Yi
patent: 5498558 (1996-03-01), Kapoor
patent: 5510278 (1996-04-01), Nguyen et al.
patent: 5557569 (1996-09-01), Smayling et al.
patent: 5600592 (1997-02-01), Atsumi et al.
patent: 5617351 (1997-04-01), Bertin et al.
patent: 5646430 (1997-07-01), Kaya et al.
patent: 5691230 (1997-11-01), Forbes
patent: 5801401 (1998-09-01), Forbes
patent: 5801993 (1998-09-01), Choi
patent: 5852306 (1998-12-01), Forbes
patent: 5880991 (1999-03-01), Hsu et al.
patent: 5923056 (1999-07-01), Lee et al.
patent: 5936274 (1999-08-01), Forbes et al.
patent: 5952692 (1999-09-01), Nakazato et al.
patent: 5963476 (1999-10-01), Hung et al.
patent: 5981350 (1999-11-01), Geusic et al.
patent: 5991225 (1999-11-01), Forbes et al.
patent: 6025627 (2000-02-01), Forbes et al.
patent: 6031263 (2000-02-01), Forbes et al.
patent: 6069816 (2000-05-01), Nishimura
patent: 6101131 (2000-08-01), Chang
patent: 6124729 (2000-09-01), Noble et al.
patent: 6127227 (2000-10-01), Lin et al.
patent: 6134175 (2000-10-01), Forbes et al.
patent: 6141238 (2000-10-01), Forbes et al.
patent: 6143636 (2000-11-01), Forbes et al.
patent: 6153468 (2000-11-01), Forbes et al.
patent: 6163049 (2000-12-01), Bui
patent: 6169306 (2001-01-01), Gardner et al.
patent: 6172397 (2001-01-01), Oonakado et al.
patent: 6208164 (2001-03-01), Noble et al.
patent: 6229175 (2001-05-01), Uchida
patent: 6238976 (2001-05-01), Noble et al.
patent: 6246606 (2001-06-01), Forbes et al.
patent: 6249020 (2001-06-01), Forbes et al.
patent: 6249460 (2001-06-01), Forbes et al.
patent: 6288419 (2001-09-01), Prall et al.
patent: 6307775 (2001-10-01), Forbes et al.
patent: 6351411 (2002-02-01), Forbes et al.
patent: 6424001 (2002-07-01), Forbes et al.
patent: 6444545 (2002-09-01), Sadd et al.
patent: 6461905 (2002-10-01), Wang et al.
patent: 6475857 (2002-11-01), Kim et al.
patent: 6586797 (2003-07-01), Forbes et al.
patent: 6740928 (2004-05-01), Yoshii et al.
patent: 6743681 (2004-06-01), Bhattacharyya
patent: 6778441 (2004-08-01), Forbes et al.
patent: 6784480 (2004-08-01), Bhattacharyya
patent: 6903969 (2005-06-01), Bhattacharyya
patent: 6950340 (2005-09-01), Bhattacharyya
patent: 6952032 (2005-10-01), Forbes et al.
patent: 2001/0013621 (2001-08-01), Nakazato
patent: 2003/0042527 (2003-03-01), Forbes et al.
patent: 2003/0042532 (2003-03-01), Forbes
patent: 2003/0043622 (2003-03-01), Forbes
patent: 2003/0043630 (2003-03-01), Forbes et al.
patent: 2003/0043632 (2003-03-01), Forbes
patent: 2003/0043633 (2003-03-01), Forbes et al.
patent: 2003/0043637 (2003-03-01), Forbes et al.
patent: 2003/0045082 (2003-03-01), Eldridge et al.
patent: 2003/0048666 (2003-03-01), Eldridge et al.
patent: 2004/0004245 (2004-01-01), Forbes et al.
patent: 2004/0004247 (2004-01-01), Forbes et al.
patent: 2004/0004859 (2004-01-01), Forbes et al.
patent: 2005/0012141 (2005-01-01), Bhattacharyya
Arya, S. P., et al., “Conduction properties of thin Al/sub 2/O/sub 3/ films”,Thin Solid Films, 91(4), (May 28, 1982), 363-374.
Bhattacharyya, A. , “Physical & Electrical Characteristics of LPCVD Silicon Rich Nitride”,ECS Technical Digest, J. Electrochem. Soc., 131(11), 691 RDP, New Orleans, (1984), 469C.
Dipert, Brian , “Flash Memory Goes Mainstream”,IEEE Spectrum, 30(10), (Oct. 1993), 48-52.
Eldridge, J. M., et al., “Growth of Thin PbO Layers on Lead Films. I. Experiment”,Surface Science, 40(3), (Dec. 1973), 512-530.
Eldridge, J. , et al., “Measurement of Tunnel Current Density in a Metal-Oxide-Metal System as a Function of Oxide Thickness”,Proc. 12th Intern. Conf. on Low Temperature Physics, (1971), 427-428.
Greiner, J., “Josephson Tunneling Barriers by rf Sputter Etching in an Oxygen Plasma”,Journal of Applied Physics, 42(12), (Nov. 1971), 5151-5155.
Greiner, J. , “Oxidation of lead films by rf sputter etching in an oxygen plasma”,Journal of Applied Physics, 45(1), (Jan. 1974), 32-37.
Gundlach, K. , et al., “Logarithmic conductivity of Al-Al/sub 2/O/sub 3/-Al tunneling junctions produced by plasma- and by thermal-oxidation”,Surface Science, 27(1), (Aug. 1971), 125-141.
Han, Kwangseok , “Characteristics of P-Channel Si Nano-Crystal Memory”,IEDM Technical Digest, International Electron Devices Meeting, (Dec. 10-13, 2000), 309-312.
Hurych, Z. , “Influence of Non-Uniform Thickness of Dielectric Layers on Capacitance and Tunnel Currents”,Solid-State Electronics, 9, (1966), 967-979.
Inumiya, S , et al., “Conformable formation of high quality ultra-thin amorphous Ta2 O5 gate dielectrics utilizing water assisted deposition (WAD) for sub 50 nm damascene metal gate MOSFETs”,IEDM Technical Digest, International Electron Devices Meeting, (Dec. 10-13, 2000), 649-652.
Kubaschewski, O. , et al., “Oxidation of Metals and Alloys”,Butterworths, London, (1962), 53-63.
Kukli, Kaupo , et al., “Atomic layer deposition of zirconium oxide from zirconium tetraiodide, water and hydrogen peroxide”,Journal of Crystal Growth, 231(1-2), (Sep. 2001), 262-272.
Luan, H. F., et al., “High Quality Ta2O5 Gate Dielectrics with Tox,eq <10Å”,IEDM Technical Digest. International Electron Devices Meeting, (Dec. 5-8, 1999), 141-143.
Ma, Yanjun , et al., “Zirconium oxide based gate dielectrics with equivalent oxide thickness of less than 1.0 nm and performance of submicron MOSFET using a nitride gate replacement process”,International Electron Devices Meeting 1999. Technical Digest, (1999), 149-152.
Manchanda, L. , “Si-doped aluminates for high temperature metal-gate CMOS: Zr-Al-Si-O, a novel gate dielectric for low power applications”,IEDM Technical Digest. International Electron Devices Meeting, (Dec. 10-13, 2000), 23-26.
Masuoka, F. , et al., “A 256K Flash EEPROM using Triple Polysilicon Technology”,IEEE International Solid-State Circuits Conference, Digest of Technical Papers, (1985), 168-169.
Masuoka, F. , et al., “A New Flash EEPROM Cell using Triple Polysilicon Technology”,International Electron Devices Meeting, Technical Digest, San Francisco, CA, (1984), 464-467.
Mori, S. , et al., “Reliable CVD Inter-Poly Dielectrics for Advanced E&EEPROM”,Symposium on VSLI Technology, Digest of Technical Papers, (1985), 16-17.
Pashley, R. , et al., “Flash Memories: the best of two worlds”,IEEE Spectrum, 26(12), (Dec. 1989), 30-33.
Pollack, S. , et al., “Tunneling Through Gaseous Oxidi

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