Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2006-04-11
2006-04-11
Nguyen, Nam (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S123000
Reexamination Certificate
active
07025866
ABSTRACT:
Methods for forming microelectronic workpieces used in electrochemical deposition processes, methods of depositing a conductive layer on a microelectronic workpiece, and articles for electrochemical deposition in semiconductor fabrication. One aspect of the invention is directed toward methods for forming microelectronic workpieces that are well-suited for electrochemical deposition processes. On embodiment of such a method comprises depositing a first conductive material on a workpiece to form an electrically conductive first layer that conforms to the workpiece. This embodiment further includes forming a seed region defined by a second layer of a second conductive material on the first layer, and forming a contact region defined by an exposed portion of the first layer that is not covered by the second layer. The contact region can extend around at least a portion of the perimeter of the workpiece.
REFERENCES:
patent: 3267010 (1966-08-01), Creutz et al.
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3664933 (1972-05-01), Clauss
patent: 3716462 (1973-02-01), Jensen
patent: 3770598 (1973-11-01), Creutz
patent: 3878066 (1975-04-01), Dettke et al.
patent: 3930963 (1976-01-01), Polichette et al.
patent: 4000046 (1976-12-01), Weaver
patent: 4134802 (1979-01-01), Herr et al.
patent: 4272335 (1981-06-01), Combs
patent: 4279948 (1981-07-01), Kukanskis et al.
patent: 4417956 (1983-11-01), McCoy
patent: 4576689 (1986-03-01), Makkaev et al.
patent: 4624749 (1986-11-01), Black et al.
patent: 4959278 (1990-09-01), Shimauchi et al.
patent: 4990224 (1991-02-01), Mahmoud
patent: 5021129 (1991-06-01), Arbach et al.
patent: 5115430 (1992-05-01), Hahne et al.
patent: 5116430 (1992-05-01), Hirai et al.
patent: 5151168 (1992-09-01), Gilton et al.
patent: 5161168 (1992-11-01), Schilling
patent: 5209817 (1993-05-01), Ahmad et al.
patent: 5256274 (1993-10-01), Poris
patent: 5284548 (1994-02-01), Carey et al.
patent: 5368711 (1994-11-01), Poris
patent: 5372848 (1994-12-01), Blackwell et al.
patent: 5409587 (1995-04-01), Sandhu et al.
patent: 5443865 (1995-08-01), Tisdale et al.
patent: 5472592 (1995-12-01), Lowery
patent: 5482891 (1996-01-01), Shieh et al.
patent: 5549808 (1996-08-01), Farooq et al.
patent: 5576052 (1996-11-01), Arledge et al.
patent: 5639316 (1997-06-01), Cabral, Jr. et al.
patent: 5674787 (1997-10-01), Zhao et al.
patent: 5695810 (1997-12-01), Dubin et al.
patent: 5719447 (1998-02-01), Gardner
patent: 5723387 (1998-03-01), Chen
patent: 5730854 (1998-03-01), Martin
patent: 5750018 (1998-05-01), Brasch
patent: 5788778 (1998-08-01), Shang et al.
patent: 5824599 (1998-10-01), Schacham-Diamand et al.
patent: 5882498 (1999-03-01), Dubin et al.
patent: 5891513 (1999-04-01), Dubin et al.
patent: 5897368 (1999-04-01), Cole, Jr. et al.
patent: 5908543 (1999-06-01), Matsunami et al.
patent: 5913147 (1999-06-01), Dubin et al.
patent: 5932077 (1999-08-01), Reynolds
patent: 5932286 (1999-08-01), Beinglass et al.
patent: 5969422 (1999-10-01), Ting et al.
patent: 5972192 (1999-10-01), Dubin et al.
patent: 6036836 (2000-03-01), Peeters et al.
patent: 6065424 (2000-05-01), Shacham-Diamand et al.
patent: 6069068 (2000-05-01), Rathore et al.
patent: 6109206 (2000-08-01), Maydan et al.
patent: 6113771 (2000-09-01), Landau et al.
patent: 6140234 (2000-10-01), Uzoh et al.
patent: 6197181 (2001-03-01), Chen
patent: 6197688 (2001-03-01), Simpson
patent: 6210781 (2001-04-01), Baum et al.
patent: 6290833 (2001-09-01), Chen
patent: 6309524 (2001-10-01), Woodruff et al.
patent: 6319831 (2001-11-01), Tsai et al.
patent: 6329297 (2001-12-01), Balish et al.
patent: 6374831 (2002-04-01), Chandran et al.
patent: 6387207 (2002-05-01), Janakiraman et al.
patent: 6413383 (2002-07-01), Chiang
patent: 6413436 (2002-07-01), Aegerter et al.
patent: 6482307 (2002-11-01), Ashjaee et al.
patent: 6632345 (2003-10-01), Chen
patent: 6638410 (2003-10-01), Chen
patent: 6790776 (2004-09-01), Ding et al.
patent: 2002/0000382 (2002-01-01), Morrissey et al.
patent: 2002/0043466 (2002-04-01), Dordi et al.
patent: 2003/0141194 (2003-07-01), Chen
patent: 2 285 174 (1995-06-01), None
patent: 52-16433 (1977-02-01), None
patent: 6-349952 (1994-12-01), None
patent: WO 99/47731 (1999-09-01), None
Yung, E.K. and Romankiw, L.T., “Fundamental Study of Acid Copper Through-Hole Electroplating Process,” Journal of The Electrochemical Society, vol. 136, No. 3, pp. 756-767, Mar. 1989, The Electrochemical Society, Inc., Pennington, New Jersey.
Yung, E.K. and Romankiw, L.T., “Plating of Copper into Through-Holes and Vias,” Journal of The Electrochemical Society, vol. 136, No. 1, pp. 206-216, Jan. 1989, The Electrochemical Society, Inc., Pennington, New Jersey.
Ali, H.O. and Christie, I.R.A., “A Review of Electroless Gold Deposition Processes,” Gold Bulletin, vol. 17, No. 4, pp. 118-127, 4th quarter 1984, International Gold Corp., Marshalltown, South Africa, month not avail.
Benedetti, A.V. et al., “Electrochemical Studies of Copper, Copper-Aluminum and Copper-Aluminum-Silver Alloys: Impedance Results in 0.5M NaCI,” Electrochimica Acta, vol. 40, 12 pages, Mar. 1995, Pergamon, Great Britain.
Bindra, P. and White, J.R., “Chapter 12: Fundamental Aspects of Electroless Copper Plating,” Electroless Plating: Fundamentals & Applications, G.O. Mallory and J.B. Hajdu, editors, pp. 289-329, Dec. 1990, Noyes Publications.
Chassaing, E. et al., “Kinetics of Copper Electrodeposition in Citrate,” Journal of Applied Electrochemistry, vol. 16, pp. 591-604, 1986, Chapman and Hall Ltd., New York, month n/a.
Chen L. and Ritzdorf T., “ECD Seed Layer for Inlaid Copper Metallization,” presented at the 195th meeting of The Electrochemical Society in Symposium G1, May 2-6, 1999, Seattle, Washington, published in Processing in ULSI Fabrication and Semiconductor/Metal Deposition II, Proceedings of the International Symposium, pp. 122-133, edited by P.C. Andricacos et al., Sep. 1999, The Electrochemical Society, Inc., Pennington, New Jersey.
Chen L. et al., “Submicron Copper Metallization by Electrochemical Deposition,” Advanced Metallization Conference in 1998: Proceedings of the Conference Held Oct. 6-8, 1998, in Colorado Springs, Colorado, pp. 111-116, edited by N. Kobayashi et al., Sep. 1999, Materials Research Society, Pittsburgh, Pennsylvania.
Chen, M. et al., “Room Temperature Self-Annealing of Electroplated and Sputtered Copper Films,” Advanced Interconnects and Contacts, Materials Research Society Symposium Proceedings vol. 564, pp. 413-420, Materials Research Society, Warrendale, Pennsylvania, Symposium held Apr. 5-7, 1999 in San Francisco, California.
Deckert, C.A., “Electroless Copper Plating. A Review: Part 1,” Plating & Surface Finishing, pp. 48-55, Feb. 1995, American Electroplaters and Surface Finishers Society, Inc., Orlando, Florida.
DeSilva, M.J. and Shacham-Diamand, Y., “A Novel Seed Layer Scheme to Protect Catalytic Surfaces for Electroless Deposition,” Journal of the Electrochemical Society, vol. 143, No. 11, pp. 3512-3516, Nov. 1996, The Electrochemical Society, Inc., Pennington, New Jersey.
Despić, A.R., “Deposition and Dissolution of Metals and Alloys. Part B: Mechanisms, Kinetics, Texture, and Morphology,” Comprehensive Treatise of Electrochemistry: vol. 7: Kinetics and Mechanisms of Electrode Processes, B.E. Conway et al., editors, pp. 451-528, Jul. 1983, Plenum Press, New York.
Dubin, V. et al., “Copper Electroplating for On-Chip Metallization,” Advanced Micro Devices, Sunnyvale, California, date n a.
Dubin, V.M. et al., “Copper Plating Techniques For ULSI Metallization,” Advanced Metallization and Internconnect Systems for ULSI Applications in 1997, Proceedings of the Materials Research Society Conference held Sep. 30-Oct. 2, 1997 in San Diego, California, R. Cheung et al., editors, pp. 405-411, 1998, Materials Research Society, Warrendale, Pennsylvania.
Dubin, V.M. et al., “Selective and Blanket Electroless Copper Deposition for
Micro)n Technology, Inc.
Nguyen Nam
Van Luan V.
LandOfFree
Microelectronic workpiece for electrochemical deposition... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microelectronic workpiece for electrochemical deposition..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic workpiece for electrochemical deposition... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3563197