Abrading – Abrading process
Reexamination Certificate
2006-07-11
2006-07-11
Nguyen, Dung Van (Department: 3723)
Abrading
Abrading process
C451S296000, C451S041000
Reexamination Certificate
active
07074113
ABSTRACT:
A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to first and second electrodes, which are spaced apart from each other and spaced apart from the microelectronic substrate. One or more electrolytes are disposed between the electrodes and the microelectronic substrate to electrically link the electrodes to the microelectronic substrate. The electrodes are then coupled to a source of varying current that electrically removes the conductive material from the substrate. The microelectronic substrate and/or the electrodes can be moved relative to each other to position the electrodes relative to a selected portion of the microelectronic substrate, and the electrodes can be integrated with a planarizing portion of the apparatus to remove material from the conductive layer by chemical-mechanical planarization.
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Nguyen Dung Van
Perkins Coie LLP
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