Method of fabricating an array of wafer scale polymeric caps

Details Method of fabricating an array of wafer scale polymeric caps Method of fabricating an array of wafer scale polymeric caps

2006-03-07

2006-03-07

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S125000, C438S460000

Reexamination Certificate

active

07008819

ABSTRACT:
A method of fabricating an array of wafer scale polymeric caps is provided. The method includes forming, in a two part mold, a plurality of first hollow molded caps from a layer of thermoplastic material which is placed in the mold. The mold has first and second mold halves which are brought together to form the caps. The first hollow molded caps are subsequently separated into an array of individual caps.

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