Gas collecting device, test head and IC device testing...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Reexamination Certificate

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07072180

ABSTRACT:
A heating element cooling cover5for covering IC devices44mounted on a substrate4, wherein a coolant is circulated to be able to contact the IC devices44, and a groove54(bypath) is provided for an air and the coolant to flow from a gas accumulation part where gas accumulation is liable to be generated inside the heat element cooling cover5to a position where the circulating coolant comes downstream of the gas accumulation portion, so that gas accumulation can be effectively removed as a result that the air in the gas accumulation part can pass through the bypath.

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