Microelectronic packages with elongated solder interconnections

Details Microelectronic packages with elongated solder interconnections Microelectronic packages with elongated solder interconnections

2006-07-18

2006-07-18

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S772000, C257S778000

Reexamination Certificate

active

07078819

ABSTRACT:
A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

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