Pad conditioner setup

Details Pad conditioner setup Pad conditioner setup

2006-07-25

2006-07-25

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S041000, C451S006000, C451S451000, C451S008000

Reexamination Certificate

active

07081037

ABSTRACT:
A method for inspecting the uniformity of the pressure applied between a conditioner and a polishing pad on a chemical mechanical polisher. A sheet of pressure sensitive material is placed between the conditioner and the polishing pad, and the conditioner is lowered onto the sheet of pressure sensitive material. A desired degree of pressure is applied between the conditioner and the polishing pad, thereby creating an impression in the sheet of pressure sensitive material, and the conditioner is lifted from the sheet of pressure sensitive material. The sheet of pressure sensitive material is inspected to determine the uniformity of the pressure applied between the conditioner and the polishing pad.

REFERENCES:
patent: 4003245 (1977-01-01), Ogata et al.
patent: 4184365 (1980-01-01), Webster
patent: 6477447 (2002-11-01), Lin
patent: 6722948 (2004-04-01), Berman
patent: 2001-337533 (2000-11-01), None

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