Method of reforming reformable members of an electronic...

Details Method of reforming reformable members of an electronic... Method of reforming reformable members of an electronic...

2006-03-21

2006-03-21

Ngo, Hung V. (Department: 2831)

Metal fusion bonding

Process

Plural joints

C438S613000

Reexamination Certificate

active

07014094

ABSTRACT:
An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member.

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