Channeled flat plate fin heat exchange system, device and...

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S104330, C165S104210, C361S699000, C174S015100, C257S715000

Reexamination Certificate

active

06988535

ABSTRACT:
A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates and a plurality of fins coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specifically, at least one of the plates preferably comprises a plurality of condenser channels configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.

REFERENCES:
patent: 596062 (1897-12-01), Firey
patent: 2039593 (1936-05-01), Hubbuch et al.
patent: 2273505 (1942-02-01), Florian
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 3771219 (1973-11-01), Tuzi et al.
patent: 3817321 (1974-06-01), von Cube et al.
patent: 4203448 (1980-05-01), Keller, Jr.
patent: 4211208 (1980-07-01), Lindner
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4345267 (1982-08-01), Corman et al.
patent: 4450472 (1984-05-01), Tuckerman et al.
patent: 4574876 (1986-03-01), Aid
patent: 4644385 (1987-02-01), Nakanishi et al.
patent: 4716494 (1987-12-01), Bright et al.
patent: 4893174 (1990-01-01), Yamada et al.
patent: 4978638 (1990-12-01), Buller et al.
patent: 5043797 (1991-08-01), Lopes
patent: 5083194 (1992-01-01), Bartilson
patent: 5265670 (1993-11-01), Zingher
patent: 5316077 (1994-05-01), Reichard
patent: 5386143 (1995-01-01), Fitch
patent: 5397919 (1995-03-01), Tata et al.
patent: 5490117 (1996-02-01), Oda et al.
patent: 5658831 (1997-08-01), Layton et al.
patent: 5675473 (1997-10-01), McDunn et al.
patent: 5696405 (1997-12-01), Weld
patent: 5703536 (1997-12-01), Davis et al.
patent: 5704416 (1998-01-01), Larson et al.
patent: 5740013 (1998-04-01), Roesner et al.
patent: 5763951 (1998-06-01), Hamilton et al.
patent: 5768104 (1998-06-01), Salmonson et al.
patent: 5880524 (1999-03-01), Xie
patent: 5886870 (1999-03-01), Omori
patent: 5901037 (1999-05-01), Hamilton et al.
patent: 5921087 (1999-07-01), Bhatia et al.
patent: 5940270 (1999-08-01), Puckett
patent: 5964092 (1999-10-01), Tozuka et al.
patent: 6021045 (2000-02-01), Johnson
patent: 6119729 (2000-09-01), Oberholzer et al.
patent: 6140860 (2000-10-01), Sandhu et al.
patent: 6167948 (2001-01-01), Thomas
patent: 6347036 (2002-02-01), Yeager et al.
patent: 6366467 (2002-04-01), Patel et al.
patent: 6397932 (2002-06-01), Calaman et al.
patent: 6443222 (2002-09-01), Yun et al.
patent: 6449157 (2002-09-01), Chu
patent: 6449162 (2002-09-01), Corbin, Jr. et al.
patent: 6457515 (2002-10-01), Vafai et al.
patent: 6459581 (2002-10-01), Newton et al.
patent: 6459582 (2002-10-01), Ali et al.
patent: 6477045 (2002-11-01), Wang
patent: 6492200 (2002-12-01), Park et al.
patent: 6578626 (2003-06-01), Calaman et al.
patent: 6588498 (2003-07-01), Reysin et al.
patent: 6600220 (2003-07-01), Barber et al.
patent: 6606251 (2003-08-01), Kenny, Jr. et al.
patent: 6743664 (2004-06-01), Liang et al.
patent: 2002/0075645 (2002-06-01), Kitano et al.
patent: 2002/0121105 (2002-09-01), McCarthy, Jr. et al.
patent: 2003/0062149 (2003-04-01), Goodson et al.
patent: 2003/0121274 (2003-07-01), Wightman
patent: 2004/0040695 (2004-03-01), Chesser et al.
patent: 2004/0052049 (2004-03-01), Wu et al.
patent: 2004/0089008 (2004-05-01), Tilton et al.
patent: 2004/0125561 (2004-07-01), Gwin et al.
patent: 2004/0160741 (2004-08-01), Moss et al.
patent: 2004/0188069 (2004-09-01), Tomioka et al.
patent: 1-256775 (1989-10-01), None
patent: 10-99592 (1998-04-01), None
patent: 2001-326311 (2001-11-01), None
Yongendra Joshi, “Heat out of small packages”, Dec. 2001, Mechanical Engineer, pp. 56-58.
Snezana Konechi et al., “Convection Cooling of Microelectronic Chips”, 1992, InterSociety Conference on Thermal Phenomena, pp. 138-144.
Michael B. Kleiner et al., “High Performance Forced Air Cooling Scheme Employing Microchannel Heat Exchangers”, 1995, IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, vol. 18, No. 4, pp. 795-804.
Jerry K. Keska Ph. D. et al., “An Experimental Study on an Enhanced Microchannel Heat Sink for Microelectronics Applications”, EEP-vol. 26-2, Advances in Electronic Packaging, 1999, vol. 2, pp. 1235-1259.
A. J. Arnold et al., “Heat Sink Design for Cooling Modules in a Forced Air Environment”, IBM Technical Disclosure Bulletin, vol. 22, No. 6, Nov. 1979, pp. 2297-2298.
“Forced Boiling Cooling System with Jet Enhancement for Crititical Heat Flux Extension”, IBM Technical Disclosure Bulletin, vol. 39, No. 10, Oct. 1996, p. 143.
“Self-Contained Active Heat Dissipation Device”, IBM Technical Disclosure Bulletin vol. 39, No. 4, Apr. 1996, pp. 115-116.
“Pin Fin Array Heat Pipe Apparatus”, IBM Technical Disclosure Bulletin, vol. 37, No. 09, Sep. 1994, p. 171.
Mali Mahalingam,Thermal Management in Semiconductor Device Packaging, 1985, Proceedings of the IEEE, vol. 73, No. 9, Sep. 1985, pp. 1396-1404.
Roy W. Knight et al.,Optimal Thermal Design of Air cooled Forced Convection finned Heat Sinks—Experimental Verification, Oct. 1992, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, No. 5 pp. 754-760.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Channeled flat plate fin heat exchange system, device and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Channeled flat plate fin heat exchange system, device and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Channeled flat plate fin heat exchange system, device and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3547871

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.