Wafer refining

Details Wafer refining Wafer refining

2006-01-17

2006-01-17

Eley, Timothy V. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S041000, C702S179000, C702S182000

Reexamination Certificate

active

06986698

ABSTRACT:
A method of in situ control for finishing semiconductor wafers to improve cost of ownership is discussed. A method to use business calculations combined with physical measurements to improve control is discussed. The use of lubricating layer control in the operative finishing interface is discussed. Use of business calculations to change the cost of finishing semiconductor wafers is discussed. The method aids control of differential lubricating films and improved differential finishing of semiconductor wafers. The method aids cost of manufacture forecasting. The method can help manage and/or reduce cost of manufacture for pre-ramp-up, ramp-up, and commercial manufacture of the workpieces. The method can aid cost of manufacture forecasting for pre-ramp-up, ramp-up, and commercial manufacture of the workpieces. The method can aid process control for pre-ramp-up, ramp-up, and commercial manufacture of workpieces. Activity based accounting can be preferred for some applications. Planarization and localized finishing can be improved using differential lubricating films for finishing. New methods and new apparatus for finishing control are disclosed.

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