Drying and gas or vapor contact with solids – Process – With nondrying treating of material
Reexamination Certificate
2006-01-10
2006-01-10
Gravini, Stephen (Department: 3749)
Drying and gas or vapor contact with solids
Process
With nondrying treating of material
C034S400000, C034S514000, C257S669000
Reexamination Certificate
active
06983551
ABSTRACT:
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of making and using such interconnecting substrates. In one aspect of the invention, an interconnecting substrate comprises a first external layer having a first external surface, a second external layer having a second external surface, and a conductive core between the first and second external layers. The conductive core can have at least a first conductive stratum between the first and second external layers, and a dielectric layer between the first conductive stratum and one of the first or second external layers. The conductive core can also include a second conductive stratum such that the first conductive stratum is on a first surface of the dielectric layer and the second conductive stratum is on a second surface of the dielectric layer. The interconnecting substrate also has at least one vent through at least one of the first conductive stratum, the second conductive stratum, and/or the dielectric layer. The vent is configured to direct moisture away from the dielectric layer, and thus the vent can be a moisture release element that allows moisture to escape from the dielectric layer during high temperature processing.
REFERENCES:
patent: 3672046 (1972-06-01), Storey, II et al
patent: 4012307 (1977-03-01), Phillips
patent: 4285780 (1981-08-01), Schachter
patent: 4769344 (1988-09-01), Sakai et al.
patent: 4777520 (1988-10-01), Nambu et al.
patent: 4855807 (1989-08-01), Yamaji et al.
patent: 4866506 (1989-09-01), Nambu et al.
patent: 4882212 (1989-11-01), SinghDeo et al.
patent: 4887149 (1989-12-01), Romano
patent: 5107328 (1992-04-01), Kinsman
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5138434 (1992-08-01), Wood et al.
patent: 5147821 (1992-09-01), McShane et al.
patent: 5191174 (1993-03-01), Chang et al.
patent: 5195023 (1993-03-01), Manzione et al.
patent: 5197183 (1993-03-01), Chia et al.
patent: 5208467 (1993-05-01), Yamazaki
patent: 5296738 (1994-03-01), Freyman et al.
patent: 5309026 (1994-05-01), Matsumoto
patent: 5314842 (1994-05-01), Sawaya et al.
patent: 5363280 (1994-11-01), Chobot et al.
patent: 5365655 (1994-11-01), Rose
patent: 5449427 (1995-09-01), Wojnarowski et al.
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5527743 (1996-06-01), Variot
patent: 5578261 (1996-11-01), Manzione et al.
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 5596231 (1997-01-01), Combs
patent: 5606204 (1997-02-01), Tsuji
patent: 5609889 (1997-03-01), Weber
patent: 5612576 (1997-03-01), Wilson et al.
patent: 5624864 (1997-04-01), Arita et al.
patent: 5635220 (1997-06-01), Izumi et al.
patent: 5665281 (1997-09-01), Drummond
patent: 5665296 (1997-09-01), Jain et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5696033 (1997-12-01), Kinsman
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 5721450 (1998-02-01), Miles
patent: 5728600 (1998-03-01), Saxelby, Jr. et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5750423 (1998-05-01), Ishii
patent: D394844 (1998-06-01), Farnworth et al.
patent: 5766649 (1998-06-01), Azuma
patent: 5767446 (1998-06-01), Ha et al.
patent: 5773322 (1998-06-01), Weld
patent: 5780351 (1998-07-01), Arita et al.
patent: 5793613 (1998-08-01), Pionelli et al.
patent: 5796159 (1998-08-01), Kierse
patent: 5815000 (1998-09-01), Farnworth et al.
patent: D402638 (1998-12-01), Farnworth et al.
patent: 5842275 (1998-12-01), McMillan, II et al.
patent: 5851845 (1998-12-01), Wood et al.
patent: 5866953 (1999-02-01), Akram et al.
patent: 5891753 (1999-04-01), Akram
patent: 5893726 (1999-04-01), Farnworth et al.
patent: 5898224 (1999-04-01), Akram
patent: 5917234 (1999-06-01), Tsuruzono
patent: 5920768 (1999-07-01), Shintai
patent: 5928595 (1999-07-01), Knapp et al.
patent: 5933713 (1999-08-01), Farnworth
patent: 5938956 (1999-08-01), Hembree et al.
patent: 5945130 (1999-08-01), Saxelby, Jr. et al.
patent: 5946553 (1999-08-01), Wood et al.
patent: 5958100 (1999-09-01), Farnworth et al.
patent: 5964030 (1999-10-01), Lee et al.
patent: 5986209 (1999-11-01), Tandy
patent: 5989941 (1999-11-01), Wensel
patent: 5990566 (1999-11-01), Farnworth et al.
patent: 5994784 (1999-11-01), Ahmad
patent: RE36469 (1999-12-01), Wood et al.
patent: 5998243 (1999-12-01), Odashima et al.
patent: 6000924 (1999-12-01), Wang et al.
patent: 6008070 (1999-12-01), Farnworth
patent: 6013946 (2000-01-01), Lee et al.
patent: 6015987 (2000-01-01), Arita et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6025728 (2000-02-01), Hembree et al.
patent: 6028365 (2000-02-01), Akram et al.
patent: 6046496 (2000-04-01), Corisis et al.
patent: 6048744 (2000-04-01), Corisis et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6049125 (2000-04-01), Brooks et al.
patent: 6054755 (2000-04-01), Takamichi et al.
patent: 6066514 (2000-05-01), King et al.
patent: 6071758 (2000-06-01), Steffen
patent: 6072236 (2000-06-01), Akram et al.
patent: 6075288 (2000-06-01), Akram
patent: 6080932 (2000-06-01), Smith et al.
patent: 6089920 (2000-07-01), Farnworth et al.
patent: 6094058 (2000-07-01), Hembree et al.
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6100598 (2000-08-01), Kanesaka
patent: 6103547 (2000-08-01), Corisis et al.
patent: 6107122 (2000-08-01), Wood et al.
patent: 6107680 (2000-08-01), Hodges
patent: 6114189 (2000-09-01), Chia et al.
patent: 6117382 (2000-09-01), Thummel
patent: 6124634 (2000-09-01), Akram et al.
patent: 6126428 (2000-10-01), Mitchell et al.
patent: 6143581 (2000-11-01), Johnson et al.
patent: 6150717 (2000-11-01), Wood et al.
patent: 6159764 (2000-12-01), Kinsman et al.
patent: 6168970 (2001-01-01), Burns
patent: 6172419 (2001-01-01), Kinsman
patent: 6175159 (2001-01-01), Sasaki
patent: 6184465 (2001-02-01), Corisis
patent: 6191472 (2001-02-01), Mazumder
patent: 6198172 (2001-03-01), King et al.
patent: 6208519 (2001-03-01), Jiang et al.
patent: 6210992 (2001-04-01), Tandy et al.
patent: 6215175 (2001-04-01), Kinsman
patent: 6228548 (2001-05-01), King et al.
patent: 6228687 (2001-05-01), Akram et al.
patent: 6229202 (2001-05-01), Corisis
patent: 6235994 (2001-05-01), Chamberlin et al.
patent: 6242802 (2001-06-01), Miles et al.
patent: 6246108 (2001-06-01), Corisis et al.
patent: 6252298 (2001-06-01), Lee et al.
patent: 6258623 (2001-07-01), Moden et al.
patent: 6258624 (2001-07-01), Corisis
patent: 6259153 (2001-07-01), Corisis
patent: 6262480 (2001-07-01), Ferri et al.
patent: 6277671 (2001-08-01), Tripard
patent: 6284571 (2001-09-01), Corisis et al.
patent: 6291894 (2001-09-01), Farnworth et al.
patent: 6291895 (2001-09-01), Taniguchi et al.
patent: 6294839 (2001-09-01), Mess et al.
patent: 6300165 (2001-10-01), Castro
patent: 6303981 (2001-10-01), Moden
patent: 6303985 (2001-10-01), Larson et al.
patent: 6309916 (2001-10-01), Crowley et al.
patent: 6310390 (2001-10-01), Moden
patent: 6314639 (2001-11-01), Corisis
patent: 6316285 (2001-11-01), Jiang et al.
patent: 6324069 (2001-11-01), Weber
patent: 6326242 (2001-12-01), Broods et al.
patent: 6326244 (2001-12-01), Brooks et al.
patent: 6326687 (2001-12-01), Corisis
patent: 6326697 (2001-12-01), Farnworth
patent: 6326698 (2001-12-01), Akram
patent: 6329220 (2001-12-01), Bolken et al.
patent: 6329603 (2001-12-01), Japp et al.
patent: 6331221 (2001-12-01), Cobbley
patent: 6331453 (2001-12-01), Bolken et al.
patent: 6332766 (2001-12-01), Thummel
patent: 6338813 (2002-01-01), Hsu et al.
patent: 6403009 (2002-06-01), Saxelby, Jr. et al.
patent: 6413801 (2002-07-01), Lin
patent: 6472252 (2002-10-01), Mess
patent: 6483044 (2002-11-01), Ahmad
patent: 2001/0038144 (2001-11-01), Grigg
patent: 2002/0016023 (2002-02-01), Bolken
patent: 2002/0048843 (2002-04-01), Bolken
patent: 2002/0050654 (2002-05-01), Bolken
patent: 2002/0052063 (2002-05-01), Bolken
patent: 2002/0175399 (2002-11-01), James et al.
patent: 2003/0029633 (2003-02-01), Ahmad
patent: 60208847 (1985-10-01), None
patent: 62-032622 (1987-02-01), None
patent: 62229949 (1987-10-01), None
patent: 01-244629 (1989-09-01), None
patent: 05299536 (19
Gravini Stephen
Micro)n Technology, Inc.
Perkins Coie LLP
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