Microelectronic assemblies having compliant layers

Details Microelectronic assemblies having compliant layers Microelectronic assemblies having compliant layers

2006-09-26

2006-09-26

Parker, Ken (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S686000, C257S687000, C257S678000, C257S690000, C257S693000, C257SE23178

Reexamination Certificate

active

07112879

ABSTRACT:
A microelectronic package includes a microelectronic element having contacts accessible at a surface thereof, a layer overlying the microelectronic element, the layer having a first surface and a sloping peripheral edge extending away from the first surface of the layer, and conductive terminals overlying the microelectronic element, wherein the layer supports the conductive terminals over the microelectronic element. The package also includes conductive traces having first ends electrically connected with the contacts of the microelectronic element and second ends electrically connected with the conductive terminals, with at least one of the conductive traces having a section that is in contact with and extends along the sloping peripheral edge of the layer, and a compliant material disposed between the conductive terminals and the microelectronic element so that the conductive terminals are movable relative to the microelectronic element.

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