Method and apparatus for solder-less attachment of an...

Electrical connectors – With wearing apparel

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C428S102000, C442S243000, C442S262000, C442S265000

Reexamination Certificate

active

07025596

ABSTRACT:
A method and apparatus form electrical connections between electronic circuits and conductive threads (102, 104, 106, 108) that are interwoven into textile material (130). Electronic circuits (128), such as semiconductor dies, are connected to a carrier (132) and electrical connections (136) are made to conductive connection areas (110, 112, 114, 116) on the carrier (132). Conductive stitching (202, 204, 206, 208) provides electrical contacts for both the conductive connection areas (110, 112, 114, 116) on the carrier (132) and the conductive threads (102, 104, 106, 108) that are interwoven into the textile material (130). Optionally, a thin, flexible substrate material (132) is perforated during the stitching process.

REFERENCES:
patent: 4016821 (1977-04-01), Minalga
patent: 4157207 (1979-06-01), Robinson
patent: 4284016 (1981-08-01), Matumura
patent: 4334142 (1982-06-01), Blackmore
patent: 4535251 (1985-08-01), Herman et al.
patent: 4791722 (1988-12-01), Miller, Jr.
patent: 4831780 (1989-05-01), Bockwinkel
patent: 4868980 (1989-09-01), Miller, Jr.
patent: 4891912 (1990-01-01), Bockwinkel
patent: 4927366 (1990-05-01), Tommerson et al.
patent: 4970109 (1990-11-01), Bryant et al.
patent: 5053021 (1991-10-01), Feibus
patent: 5308667 (1994-05-01), Calhoun et al.
patent: 5328079 (1994-07-01), Mathew et al.
patent: 5366780 (1994-11-01), Rapisarda
patent: 5531601 (1996-07-01), Amoroso
patent: 5569877 (1996-10-01), Yumi
patent: 5968854 (1999-10-01), Akopian et al.
patent: 6160246 (2000-12-01), Rock et al.
patent: 6210771 (2001-04-01), Post et al.
patent: 6373034 (2002-04-01), Rock et al.
patent: 6414286 (2002-07-01), Rock et al.
patent: 6501055 (2002-12-01), Rock et al.
patent: 6531687 (2003-03-01), Michelmann
patent: 6561814 (2003-05-01), Tilbury et al.
patent: 6564449 (2003-05-01), Tsai et al.
patent: 6729025 (2004-05-01), Farrell et al.
patent: 2003/0211797 (2003-11-01), Hill et al.
patent: 2004/0009729 (2004-01-01), Hill et al.
E.R. Post et al., “E-broidery: Design and fabrication of textile based computing”; IBM Systems Journal, vol. 39, Nos. 3 & 4, 2000, MIT Media Laboratory, http://www.research.ibm.com/journal/sj/393/part3/post.html.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for solder-less attachment of an... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for solder-less attachment of an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for solder-less attachment of an... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3544818

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.