Stacking structure for semiconductor chips and a...

Details Stacking structure for semiconductor chips and a... Stacking structure for semiconductor chips and a...

2006-01-03

2006-01-03

Graybill, David E. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S777000, C257S780000, C257S784000, C257S787000

Reexamination Certificate

active

06982485

ABSTRACT:
A semiconductor package and method of producing the same has a substrate having a resin layer with first and second surfaces. A plurality of electrically conductive patterns are formed on the resin layer. An aperture is also formed at the center of the substrate. A first semiconductor chip has first and second surfaces. The second surface of the first semiconductor chip has a plurality of input/output pads formed thereon. The first semiconductor chip is placed in the aperture of the substrate. A plurality of first conductive wires connect the input/output pads of the first semiconductor chip to the electrically conductive patterns formed on the second surface of the resin layer. A second semiconductor chip having first and second surfaces is coupled to the first semiconductor chip. The second surface of the second semiconductor chip has a plurality of input/output pads formed thereon. A plurality of second conductive wires connect the input/output pads of the second semiconductor chip to the electrically conductive patterns formed on the second surface of the resin layer. An encapsulate is used to encapsulate the aperture of the substrate, the first and second semiconductor chips, and the first and second conductive wires. A plurality of conductive balls are coupled to the electrically conductive patterns formed on the second surface of the resin layer of the substrate.

REFERENCES:
patent: 4763188 (1988-08-01), Johnson
patent: 5012323 (1991-04-01), Faraworth
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5328079 (1994-07-01), Mathew et al.
patent: 5347429 (1994-09-01), Kohno et al.
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5495398 (1996-02-01), Takiar et al.
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5541450 (1996-07-01), Jones et al.
patent: 5552966 (1996-09-01), Nagano
patent: 5581498 (1996-12-01), Ludwig et al.
patent: 5639695 (1997-06-01), Jones et al.
patent: 5646830 (1997-07-01), Nagano
patent: 5674785 (1997-10-01), Akram et al.
patent: 5689135 (1997-11-01), Ball
patent: 5696031 (1997-12-01), Wark
patent: 5715147 (1998-02-01), Nagano
patent: 5721452 (1998-02-01), Fogal et al.
patent: 5735030 (1998-04-01), Orcutt
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5773884 (1998-06-01), Andros et al.
patent: 5798014 (1998-08-01), Weber
patent: 5815372 (1998-09-01), Gallas
patent: 5835355 (1998-11-01), Dordi
patent: 5843808 (1998-12-01), Karnezos
patent: 5866949 (1999-02-01), Schueller
patent: 5886412 (1999-03-01), Fogal et al.
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5905634 (1999-05-01), Takeda et al.
patent: 5920117 (1999-07-01), Sono et al.
patent: 5952611 (1999-09-01), Eng et al.
patent: 5972736 (1999-10-01), Malladi et al.
patent: 5973403 (1999-10-01), Wark
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: RE36613 (2000-03-01), Ball
patent: 6034427 (2000-03-01), Lan et al.
patent: 6043559 (2000-03-01), Banerjee et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6057598 (2000-05-01), Payne et al.
patent: 6060778 (2000-05-01), Jeong et al.
patent: 6072243 (2000-06-01), Nakanishi
patent: 6080264 (2000-06-01), Ball
patent: 6081426 (2000-06-01), Takeda et al.
patent: 6118176 (2000-09-01), Tao et al.
patent: 6122171 (2000-09-01), Akram et al.
patent: 6127833 (2000-10-01), Wu et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6140149 (2000-10-01), Wark
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6163076 (2000-12-01), Lee et al.
patent: 6172419 (2001-01-01), Kinsman
patent: 6184463 (2001-02-01), Panchou et al.
patent: 6214641 (2001-04-01), Akram
patent: 6215182 (2001-04-01), Ozawa et al.
patent: 6215193 (2001-04-01), Tao et al.
patent: 6235554 (2001-05-01), Akram et al.
patent: 6252305 (2001-06-01), Lin et al.
patent: 6258626 (2001-07-01), Wang et al.
patent: 6313519 (2001-11-01), Gainey et al.
patent: 6313522 (2001-11-01), Akram et al.
patent: 6316727 (2001-11-01), Liu
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6326696 (2001-12-01), Horton et al.
patent: 6333562 (2001-12-01), Lin
patent: 6359340 (2002-03-01), Lin et al.
patent: 6365966 (2002-04-01), Chen et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6387728 (2002-05-01), Pai et al.
patent: 6395578 (2002-05-01), Shin et al.
patent: 6400007 (2002-06-01), Wu et al.
patent: 6407456 (2002-06-01), Ball
patent: 6414396 (2002-07-01), Shim et al.
patent: 6437449 (2002-08-01), Foster
patent: 6441496 (2002-08-01), Chen et al.
patent: 6445594 (2002-09-01), Nakagawa et al.
patent: 6452278 (2002-09-01), DiCaprio et al.
patent: 6461897 (2002-10-01), Lin et al.
patent: 6495773 (2002-12-01), Nomoto et al.
patent: 6503776 (2003-01-01), Pai et al.
patent: 6552416 (2003-04-01), Foster
patent: 6555902 (2003-04-01), Lo et al.
patent: 6555917 (2003-04-01), Heo
patent: 6561411 (2003-05-01), Lee
patent: 6563205 (2003-05-01), Fogal et al.
patent: 6564449 (2003-05-01), Tsai et al.
patent: 6607943 (2003-08-01), Kinsman
patent: 6621155 (2003-09-01), Perino et al.
patent: 6621169 (2003-09-01), Kikuma et al.
patent: 6657290 (2003-12-01), Fukui et al.
patent: 6759737 (2004-07-01), Seo et al.
patent: 6762078 (2004-07-01), Shin et al.
patent: 6784534 (2004-08-01), Glenn et al.
patent: 6787926 (2004-09-01), Chen et al.
patent: 6790710 (2004-09-01), McLellan et al.
patent: 6798049 (2004-09-01), Shin et al.
patent: 6798063 (2004-09-01), Kinsman
patent: 2002/0047213 (2002-04-01), Komiyama et al.
patent: 2002/0079570 (2002-06-01), Ho et al.
patent: 2002/0153615 (2002-10-01), Komiyama et al.
Abstract 62-126661, English Abstract of Japanese Patent Application No. 60-267712, Published Jun. 8, 1987, Inventor Hiromi Sakata.
Abstract 4-56262, English Abstract of Japanese Patent Application No. 2-167207, Published Feb. 24, 1992, Inventor Susumu Sanai.
Abstract 63-244654, English Abstract of Japanese Patent Application No. 62-76176, Published Oct. 12, 1988, Inventor Hiromichi Sawatani.
Publication No. 05136323, English Abstract of Japanese Patent Application No. 03297304, Published Jun. 1, 1993, Inventor Yoshino Susumu and Chikama Hiroki.
Publication No. 05109975, English Abstract of Japanese Patent Application No. 03264522, Published Apr. 30, 1993, Inventor Ryuji et al.
Patent No. JP61117858, English Abstract, Published Jun. 5, 1986, Inventor Takahashi Hidekazu.
Publication No. 04028260, English Abstract of Japanese Patent Application No. 02133391, Published Jan. 30, 1992, Inventor Nakano Katsuhiro.
Publication No. 04116859 English Abstract of Japanese Patent Application No. 02237713, Published Apr. 17, 1992, Inventor Sawano Hiroshi.
Publication No. 04096358, English Abstract of Japanese Patent Application No. 02211544, Published Mar. 27, 1992, Inventor Fukui Yuichi.
Publication No. 05013665, English Abstract of Japanese Patent Application No. 03183498, Published Jan. 22, 1993, Inventor Yamauchi Fushimi and Kawazumi Masaru.
Patent No. JP1028856, English Abstract, Published Jan. 31, 1989, Inventor Takeuchi Ryosuke.
Publication No. 01099248, English Abstract of Japanese Patent Application No. 62258632, Published Apr. 18, 1989, Inventor Kosugi Ryuichi.
Patent No. JP60182731, English Abstract, Published Sep. 18, 1985, Inventor Kawaguchi Tamotsu.
Patent No. JP56062351, English Abstract, Published May 28, 1981, Inventor Sano Yuji.
Patent No. JP3169062 English Abstract, Published Jul. 22, 1991, Inventor Goto Seiji.
Publication No. 10-256470, English Abstract of Japanese Patent Application No. 09-055176, Published Sep. 25, 1998, Inventor Tsubonoya Makoto.
Patent No. JP1071162, English Abstract, Published Mar. 16, 1989, Inventor Wantanabe Masayuki.
Abstract 5-75015, English Abstract of Japanese Patent Application No. 3-234485, Published Mar. 26, 1993, Inventor Akio Goto.
Publication No. 0503201, European Patent Appli

Affiliated with

Also associated with

Rating

Stacking structure for semiconductor chips and a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacking structure for semiconductor chips and a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacking structure for semiconductor chips and a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3542327