Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-03-07
2006-03-07
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S081000, C257S433000, C257S704000, C257S713000, C257S730000, C257S737000, C257S749000
Reexamination Certificate
active
07009295
ABSTRACT:
A semiconductor device includes a semiconductor chip having a main surface provided with an integrated circuit including a photoelectric converter and a first wiring for electrically connecting the integrated circuit of the semiconductor chip to respective external terminals. The semiconductor device also includes a sealing resin for sealing the main surface of the semiconductor chip and the first wiring, formed so as to have an opening over the surface of the integrated circuit and a light-transmitting cap for covering the opening of the sealing resin.
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Huynh Andy
Oki Electric Industry Co. Ltd.
Wenderoth , Lind & Ponack, L.L.P.
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