Semiconductor package containing an integrated-circuit chip...

Details Semiconductor package containing an integrated-circuit chip... Semiconductor package containing an integrated-circuit chip...

2006-04-18

2006-04-18

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S692000

Reexamination Certificate

active

07030471

ABSTRACT:
Semiconductor package containing an integrated-circuit chip, characterized in that it comprises a leadframe formed from spaced-apart electrical connection leads (5), the integrated-chip being fixed to or supported by a front surface of the leads, electrical connection means (16) for connecting the integrated-chip to the electrical connection leads and a block (20) of an encapsulation material in which at least the electrical connection leads are at least partly embedded.

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patent: 6828220 (2004-12-01), Pendse et al.
patent: 2002/0093026 (2002-07-01), Huang
patent: 2002/0093078 (2002-07-01), Paek
Cha Ki-Bon et al. “Ultra-Thin and Crack-Free Bottom Leaded Plastic (BLP) Package Design”, Proceedings of the Electronic Components and Technology Conference, Las Vegas, May 21-24, 1995, New York, IEEE, vol. Conf. 45, May 21, 1995, pp. 224-228, XP000624973.
French Preliminary Search Report dated Nov. 18, 2003 for French Application No. 0301964.

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