Assembly of electronic components onto substrates

Details Assembly of electronic components onto substrates Assembly of electronic components onto substrates

1998-10-01

2000-04-04

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29833, 29 8, 228 563, H05K 334

Patent

active

060445491

ABSTRACT:
In a method of assembling an electronic component onto a substrate, a fiducial is defined by a solder mask positioned upon the substrate. A fiducial-defining window in the mask has a base of the window completely provided with a material of different light-reflecting quality than the mask surface. This provides for the peripheral edge of the window, i.e. the mask, to be the edge of the fiducial. Windows in the mask which expose terminal pads upon the substrate and fixed in position relative to edges of the fiducial and both these windows and the fiducial are determined by the mask. Surface mount components are then located upon the substrate relative to the window positions and not relative to the terminal pad positions. This process reduces the number of incorrect connections of terminals of components to terminal pads.

REFERENCES:
patent: 5457880 (1995-10-01), McKinley et al.
patent: 5593080 (1997-01-01), Teshima et al.
patent: 5743007 (1998-04-01), Onishi et al.

Affiliated with

Also associated with

Rating

Assembly of electronic components onto substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Assembly of electronic components onto substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembly of electronic components onto substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-354057