Method and apparatus for controlling planarizing...

Details Method and apparatus for controlling planarizing... Method and apparatus for controlling planarizing...

2006-07-18

2006-07-18

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S285000, C451S287000

Reissue Patent

active

RE039194

ABSTRACT:
A method and apparatus for mechanical and/or chemical-mechanical planarization of microelectronic substrates. In one embodiment, an apparatus for controlling the planarizing characteristics of a microelectronic substrate has a carrier that may be positioned with respect to a polishing medium of a planarizing machine to move with respect to a microelectronic substrate during planarization. The apparatus may also have a modulator with a contact element, and the modulator may be attached to the carrier to position at least a portion of a contact element in front of a leading edge of the substrate by a selected distance during planarization. In operation, the modulator causes the contact element to selectively engage a region of the planarizing surface to modulate the contour of the planarizing surface during planarization.

REFERENCES:
patent: 5635083 (1997-06-01), Breivogel et al.
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 5851136 (1998-12-01), Lee

Affiliated with

Also associated with

Rating

Method and apparatus for controlling planarizing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for controlling planarizing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for controlling planarizing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3538993