Sn-Zn lead-free solder alloy and soldered bond

Details Sn-Zn lead-free solder alloy and soldered bond Sn-Zn lead-free solder alloy and soldered bond

2006-07-04

2006-07-04

Ip, Sikyin (Department: 1742)

Alloys or metallic compositions

Tin base

C148S400000

Reexamination Certificate

active

07070736

ABSTRACT:
An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt % aluminum. Upon preservation of solder paste not only under refrigeration but also at a room temperature or higher, the inside of solder particle is protected by the protective magnesium/aluminum oxide film formed on the solder particle surface, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at the elevated temperature during soldering, the solder alloy enters a state where said protective oxide film is easily destroyed, so that good wettability is held.

REFERENCES:
patent: 6080497 (2000-06-01), Carey et al.
patent: 2000015478 (2000-01-01), None
patent: 0234969 (2002-05-01), None

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