Mold component and mold assembly

Plastic article or earthenware shaping or treating: apparatus – With apparatus assembly or dismantling means or with idle part – For extrusion or injection type shaping means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C425S542000, C425S810000

Reexamination Certificate

active

07044726

ABSTRACT:
There is provided a mold component which makes it possible to mold a substrate for an optical recording medium which enables a functional layer having a uniform thickness to be formed thereon without using a resin-coating assisting member. A stamper holder holds a stamper thereon, and has a generally hollow cylindrical shape. An insertion hole formed through a central portion of the stamper has a diameter which is larger than an outer diameter of a cavity-side end of the stamper holder at a higher temperature of the holder than a normal temperature, and is slightly smaller than the outer diameter at the normal temperature of the holder. The cavity-side end inserted into the insertion hole at the higher temperature of the stamper is grasped by a rim of the insertion hole which is reduced in diameter at the normal temperature of the stamper.

REFERENCES:
patent: 5466145 (1995-11-01), Takahashi
patent: 9-123229 (1997-05-01), None
patent: 9-193206 (1997-07-01), None
patent: 2003-11169 (2003-01-01), None
English Language Abstract of JP 9-193206.
English Language Abstract of JP 2003-11169.
English Language Abstract of JP 9-123229.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Mold component and mold assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold component and mold assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold component and mold assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3533921

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.