Thin-film semiconductor device and method of manufacturing...

Details Thin-film semiconductor device and method of manufacturing... Thin-film semiconductor device and method of manufacturing...

2006-04-18

2006-04-18

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

Reexamination Certificate

active

07029950

ABSTRACT:
A thin-film semiconductor device with a reduced influence on a device formation layer in separation and a method of manufacturing the device are provided. The manufacturing method includes the step of preparing a member having a semiconductor film with a semiconductor element and/or semiconductor integrated circuit on a separation layer, the separation step of separating the member at the separation layer by a pressure of a fluid, and the chip forming step of, after the separation step, forming the semiconductor film into chips.

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