Semiconductor interconnect having compliant conductive contacts

Details Semiconductor interconnect having compliant conductive contacts Semiconductor interconnect having compliant conductive contacts

2006-05-09

2006-05-09

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S690000, C257S698000, C257S773000, C438S666000, C438S618000

Reexamination Certificate

active

07042080

ABSTRACT:
An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor component. Each interconnect contact includes a compliant conductive layer formed as a conductive spring element. In addition, the complaint conductive layer includes a tip for engaging the component contact and a spring segment portion for resiliently supporting the tip. A method for fabricating the interconnect includes the steps of shaping the substrate, forming a conductive layer on a shaped portion of the substrate and removing at least some of the shaped portion. The shaped portion can comprise a raised step or dome, or a shaped recess in the substrate. The conductive layer can comprise a metal, a conductive polymer or a polymer tape can include a penetrating structure or penetrating particles. The interconnect can be used to construct wafer level test systems, and die level test systems as well, for semiconductor components such as wafers, dice and packages.

REFERENCES:
patent: 5216631 (1993-06-01), Sliwa, Jr.
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5478779 (1995-12-01), Akram
patent: 5483741 (1996-01-01), Akram et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5519332 (1996-05-01), Wood et al.
patent: 5541525 (1996-07-01), Wood et al.
patent: 5559444 (1996-09-01), Farnworth et al.
patent: 5592736 (1997-01-01), Akram et al.
patent: 5686317 (1997-11-01), Akram et al.
patent: 5716218 (1998-02-01), Farnworth et al.
patent: 5756370 (1998-05-01), Farnworth et al.
patent: 5781022 (1998-07-01), Wood et al.
patent: 5783461 (1998-07-01), Hembree
patent: 5815000 (1998-09-01), Farnworth et al.
patent: 6005288 (1999-12-01), Farnworth et al.
patent: 6020220 (2000-02-01), Gilleo et al.
patent: 6068669 (2000-05-01), Farnworth et al.
patent: 6072321 (2000-06-01), Akram et al.
patent: 6232243 (2001-05-01), Farnworth et al.
patent: 6247228 (2001-06-01), Distefano et al.
patent: 6259036 (2001-07-01), Farnworth
patent: 6265245 (2001-07-01), Farnworth et al.
patent: 6275052 (2001-08-01), Hembree et al.
patent: 6285204 (2001-09-01), Farnworth
patent: 6310484 (2001-10-01), Akram et al.
patent: 6400172 (2002-06-01), Akram et al.
patent: 6437591 (2002-08-01), Farnworth et al.
patent: 6498503 (2002-12-01), Akram et al.
patent: 6524346 (2003-02-01), Farnworth
patent: 6544902 (2003-04-01), Farnworth
patent: 6624653 (2003-09-01), Cram
patent: 6708399 (2004-03-01), Farnworth et al.
patent: 6727715 (2004-04-01), Cram
patent: 6741091 (2004-05-01), Cram
patent: 6756802 (2004-06-01), Cram
patent: 6825685 (2004-11-01), Cram
patent: 6828812 (2004-12-01), Farnworth et al.
patent: 6853210 (2005-02-01), Farnworth et al.
U.S. Appl. No. 09/259,143 filed Feb. 26, 1999.
U.S. Appl. No. 09/652,340 filed Aug. 31, 2000.
U.S. Appl. No. 60/425,567 filed Nov. 11, 2002.

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