Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-01-31
2006-01-31
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S737000, C361S748000, C361S749000, C361S767000, C361S808000, C257S678000, C174S255000, C174S260000, C174S250000
Reexamination Certificate
active
06992898
ABSTRACT:
A smart-card module is described which has a substrate film of an anisotropically conductive material and at least one semiconductor chip. The semiconductor chip has connection points. On one surface of the semiconductor film, contact areas are applied directly. The substrate film is disposed between the semiconductor chip and the contact areas in such a way that it connects the connection points of the semiconductor chip to the contact areas in a manner of a direct contact.
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Heinemann Erik
Houdeau Detlef
Püschner Frank
Cuneo Kamand
Greenberg Laurence A.
Infineon - Technologies AG
Levi Dameon E.
Locher Ralph E.
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