Removal of excimer laser debris using carbon dioxide laser

Details Removal of excimer laser debris using carbon dioxide laser Removal of excimer laser debris using carbon dioxide laser

1991-10-17

1993-03-16

Albritton, C. L.

Electric heating

Metal heating

By arc

21912176, B23K 2600

Patent

active

051947137

ABSTRACT:
Disclosed is a method of fabricating a microelectronic circuit package. The circuit package has a reinforced fluorocarbon polymer dielectric. According to the disclosed process, vias or through holes are formed in the composite by a process that leaves debris. The debris in the formed vias or through holes is reflowed in order to smooth the via and through hole walls for subsequent plating.

REFERENCES:
patent: 4081655 (1978-03-01), Gale
patent: 5108562 (1992-04-01), Duke et al.

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