Cleaning method and cleaning apparatus for performing the same

Details Cleaning method and cleaning apparatus for performing the same Cleaning method and cleaning apparatus for performing the same

2006-01-10

2006-01-10

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With means to movably mount or movably support the work or...

C134S095300, C134S103200, C134S144000, C134S148000, C134S149000, C134S151000, C134S153000, C134S154000, C134S157000, C134S184000, C134S198000, C134S902000

Reexamination Certificate

active

06983755

ABSTRACT:
A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the cleaning liquid from moving into a center portion of the semiconductor substrate. The cleaning liquid supplied to the edge section flows from the edge section towards a side section of the semiconductor substrate due to the rotation of the semiconductor substrate. An ultrasonic wave generator is provided above the edge section for generating ultrasonic waves. The ultrasonic waves are applied to the cleaning liquid supplied onto the edge and bottom sections, thereby improving the cleaning efficiency. The cleaning apparatus has a guide to guide the cleaning liquid supplied to the edge section toward the side section. The cleaning apparatus may effectively remove impurities from the edge, side and bottom sections of the semiconductor substrate.

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Office Action, Korean Application No.: 10-2001-0074311, Jan. 26, 2004, 2 pages.

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