Fragmented backplane system for I/O applications

Details Fragmented backplane system for I/O applications Fragmented backplane system for I/O applications

2005-08-23

2005-08-23

Hammond, Briggitte R. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C361S788000

Reexamination Certificate

active

06932617

ABSTRACT:
A backplane system allowing a very large number of interconnections between high-connectivity printed circuit boards and a backplane is disclosed. The backplane is fragmented into a plurality of backplane parts that comprise connectors on their edges to mate connectors arranged on the high-connectivity printed circuit boards. These backplane parts may also include other connectors on their edges to couple to extension printed circuit boards requiring less interconnections or cables. Interposers can be used to link several backplane parts and provide enhanced air circulation.

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