High frequency semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S499000, C257S750000, C257S759000, C257S760000

Reexamination Certificate

active

06903459

ABSTRACT:
A high frequency (HF) semiconductor device includes a semiconductor substrate. An electroconductor layer is provided on the semiconductor substrate. A first insulator layer electrically insulates the electroconductor layer from the semiconductor substrate. N pieces of wires are provided on the semiconductor substrate, and N-phase signals (where N represents a positive integer greater than 2) are fed to the wires. A second insulator layer electrically insulates the wires from the electroconductor layer and the semiconductor substrate. N1pieces of the wires are provided on one side of the electroconductor layer (where N1represents 0 or a positive integer equaling or less than N). N2pieces of the wires are provided on the other side of the electroconductor layer (where N2represents 0 or a positive integer satisfying N1+N2=N).

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Cheon Soo Kim et al., “Gate Layout and Bonding Pad Structure of a RF n-MOSFET for Low Noise Performance”, IEEE Electron Device Letters, Vo. 21, No. 12, Dec. 2000, pp. 607-609.
John T. Colvin et al., “A Bond-Pad Structure for Reducing Effects of Substrate Resistance on LNA Performance in a Silicon Bipolar Technology”, IEEE, pp. 109-112.

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